MSAP substrates (Computers - Hardware)

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Item ID 3425515 in Category: Computers - Hardware

MSAP substrates




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The subtractive process starts with a metal sheet that covers the entire MSAP substrates. The unwanted metal is then carefully eliminated by chemical etching or mechanical machining to make the desired circuit layout. This technique protects the necessary portions by covering them with a photosensitive coating. However, subtractive manufacturing is already an established method that is suitable for mainstream PCB manufacturing. It may not be the best for high-density, small-scale, or precision-required circuit boards.

Contact Info:-

High Quality PCB Co., Limited

Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China

Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China

Plant 2 address: Zhuhai, Guangdong, China

Plant 3 address: Dongguan, Guangdong, China

TEL: +86-755-23724206

WahtsApp: +86-189 2381 2997

Skype: shawnwang2006

Email: sales@efpcb.com



Target State: All States
Target City : Shenzhen
Last Update : 03 June 2024 9:08 PM
Number of Views: 139
Item  Owner  : Shawn Wang
Contact Email:
Contact Phone: +86-755-23724206

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2024-12-22 (0.386 sec)